Full Membrane Ultra-High Purity Water Treatment Solution for Wafer Fabrication

1. Project Overview

Wet cleaning production line for high-end logic wafers with water consumption of 40 m³/h; over 150 cleaning procedures for single wafers. Tiny impurities in water will lead to lithography defects and gate leakage, complying with international high-end semiconductor process water quality control standards.

2. Core Outlet Water Control Indicators (Constant 25℃)

Resistivity ≥18.1 MΩ·cm

TOC ≤0.8 ppb

Total metal ions ≤0.05 ppt

Particulates ≥0.05 μm: less than 1 particle per mL

Microorganisms ＜0.1 CFU/mL

Silica dioxide ＜1 ppb

3. Complete Process Route

Raw Water Supply Tank→Self-Cleaning Ultrafiltration Pre-Treatment System→Multi-Media + Activated Carbon Deep Filtration→Scale Inhibitor/Reductant Dosing System→3μm Security Filter→1st-Stage Anti-Fouling RO→2nd-Stage Low-Boron Special RO→Intermediate Pure Water Tank→EDI Deep Desalination→Vacuum Membrane Degassing→Dual-Wavelength TOC UV→Polishing Mixed Bed→Ultrapure Water Storage Tank (Fully Nitrogen Sealed)→Constant Temperature Circulating Pipeline Network→Multi-Stage Terminal Precision Filter→Wafer Cleaning Workstation

4. System Configuration & Value

Front-end high-flow ultrafiltration stabilizes RO influent SDI value below 1. Special low-boron reverse osmosis membranes achieve over 96% boron removal efficiency. Two-stage deep purification via EDI and polishing mixed bed enables resistivity close to theoretical pure water.

Storage tanks and pipelines are fully sealed with high-purity nitrogen, equipped with constant temperature devices to maintain water temperature at 25℃. A high-flow circulating pipeline network eliminates stagnant water retention. SCADA remote intelligent monitoring is deployed; alarms and water supply cut-off will be triggered automatically when indicators such as resistivity, TOC and particle size exceed limits.

The overall system achieves a water recovery rate over 90% with classified concentrated water reuse units. Fully automatic operation reduces water pollution risks caused by manual handling, fully meeting the ultra-clean water demand of advanced wafer manufacturing processes.